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BST-705 500g Strong Adhesive Lead Free Silver With Silver Tin Soldering Flux Welding Solder PasteBST-705 500g Strong Adhesive Lead Free Silver With Silver Tin Soldering Flux Welding Solder PasteBST-705 500g Strong Adhesive Lead Free Silver With Silver Tin Soldering Flux Welding Solder PasteBST-705 500g Strong Adhesive Lead Free Silver With Silver Tin Soldering Flux Welding Solder PasteBST-705 500g Strong Adhesive Lead Free Silver With Silver Tin Soldering Flux Welding Solder PasteBST-705 500g Strong Adhesive Lead Free Silver With Silver Tin Soldering Flux Welding Solder Paste

BST-705 500g Strong Adhesive Lead Free Silver With Silver Tin Soldering Flux Welding Solder Paste

  • Place of Origin:Guangdong, China
  • Brand Name:BESTOOL
  • Type:Lead-free solder paste
  • Alloy composition:Tin:99% / silver: 0.3% / copper:0.7%
  • Melting point :226-229 °C
  • Tin powder particle size:25-45/μm
  • Metal content:89.5 ± 1%
  • N.W.:500g/pc
  • Application:PCB
  • Material:Alloy Powder
  • Usage:PCB Repair
  • Certificate:ISO9001
  • Product Certification Verified
  • CE Certified.
  • FCC Certified.
  • Valid from 2018-11-23 until 2049-12-31
  • RoHS Certified.
  • Supply Ability:5000 Piece/Pieces per Month
  • Packaging Details
  • Retail package: bottle
  • Port shenzhen
  • Lead Time :
  • Quantity(Pieces) 1 - 3000 >3000
  • Est. Time(days) 5 To be negotiated
Product Description

 

BEST-solder (Tin) paste is the best choice of reballing IC .

original BEST brand  ,

Quality Verified                          

                         

Application: can be used for laptop /computer/mobile phone/home Appliances SMD IC and BGA IC repairing ,tools for chip-levelrepairing and  Electronics Manufacture line

 

Technology  Parameter  

Model

BEST-705 

Alloy composition:

Tin:99% / silver: 0.3% / copper:0.7% 

Melting point :

226-229 °C

Tin powder particle size:

25-45/μm

Tin powder shapes: 

spherical

Metal content:

89.5 ± 1%

Refrigeration temperature:

5 ~ 10 °C

N.W.:

50g/pc
















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