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BST-705 500g Strong Adhesive Lead Free Silver With Silver Tin Soldering Flux Welding Solder Paste
- Place of Origin:Guangdong, China
- Brand Name:BESTOOL
- Type:Lead-free solder paste
- Alloy composition:Tin:99% / silver: 0.3% / copper:0.7%
- Melting point :226-229 °C
- Tin powder particle size:25-45/μm
- Metal content:89.5 ± 1%
- N.W.:500g/pc
- Application:PCB
- Material:Alloy Powder
- Usage:PCB Repair
- Certificate:ISO9001
- Product Certification Verified
- CE Certified.
- FCC Certified.
- Valid from 2018-11-23 until 2049-12-31
- RoHS Certified.
- Supply Ability:5000 Piece/Pieces per Month
- Packaging Details
- Retail package: bottle
- Port shenzhen
- Lead Time :
- Quantity(Pieces) 1 - 3000 >3000
- Est. Time(days) 5 To be negotiated
Product Description
BEST-solder (Tin) paste is the best choice of reballing IC .
original BEST brand ,
Quality Verified
Application: can be used for laptop /computer/mobile phone/home Appliances SMD IC and BGA IC repairing ,tools for chip-levelrepairing and Electronics Manufacture line.
Technology Parameter
|
Model |
BEST-705 |
|
Alloy composition: |
Tin:99% / silver: 0.3% / copper:0.7% |
|
Melting point : |
226-229 °C |
|
Tin powder particle size: |
25-45/μm |
|
Tin powder shapes: |
spherical |
|
Metal content: |
89.5 ± 1% |
|
Refrigeration temperature: |
5 ~ 10 °C |
|
N.W.: |
50g/pc |
SHENZHEN JINLIYANG TECHNOLOGY CO., LTD.
Tel:+86 158 1877 6906
Wechat:+86 158 1877 6906
Contact Person:kelvin
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