Key Features:

Nanocomposite Superconducting Technology

Quick welding and quick removal of oxidation marks

Fully filled solder pads, with clear and transparent residue, making it easy for flying wires to move and align with points

Rapid removal of intermediate oxidation points – Safe and Efficient

Equipped with needles (Free 3 needles, randomly colored) for controllable dosage

Reject waste and quickly carry out solder joint repairs

Applicable Scenarios:
Specially designed for assisting and strengthening soldering of:

Power amplifier type chips

External pin chips

Circuit boards without tin plating

Chips with solder pads that are not easy to absorb after adhesive removal

Fingerprint flying wires

Battery sockets

Tail plugs

Inline sockets

Quick welding of cable tray

Quick welding of screw posts

Fix the phone tail plug

Repair the motherboard screw post

Repair chip pin leads

Repair the motherboard internal connector