Home > Category > Accessories Series > Soldering Paste > BST-706 Tin Cream Welding Solder BGA Flux For Soldering Welding Tool Welder Repair Rework Solder Paste
Contact Us
QQ: 2355473736
Skype: Morningkelvin
WhatsApp: +86 15818776906
Email: kelvin@glf-tool.com Contact Now
BST-706 Tin Cream Welding Solder BGA Flux For Soldering Welding Tool Welder Repair Rework Solder PasteBST-706 Tin Cream Welding Solder BGA Flux For Soldering Welding Tool Welder Repair Rework Solder PasteBST-706 Tin Cream Welding Solder BGA Flux For Soldering Welding Tool Welder Repair Rework Solder PasteBST-706 Tin Cream Welding Solder BGA Flux For Soldering Welding Tool Welder Repair Rework Solder PasteBST-706 Tin Cream Welding Solder BGA Flux For Soldering Welding Tool Welder Repair Rework Solder PasteBST-706 Tin Cream Welding Solder BGA Flux For Soldering Welding Tool Welder Repair Rework Solder Paste

BST-706 Tin Cream Welding Solder BGA Flux For Soldering Welding Tool Welder Repair Rework Solder Paste

  • Place of Origin:Guangdong, China
  • Brand Name:BESTOOL
  • Usage:Welding
  • Application:PCB
  • Product name:Exothermic Welding Powder
  • Material:Alloy Powder
  • Item:GM-C
  • Certificate:RoHS
  • Weight:500g
  • Packing:Heat Sealed Polyethylene (PE) Bags
  • Feature:High Activity
  • Performance:Easy
  • Product Certification Verified
  • CE Certified.
  • Valid from 2018-11-23 until 2049-12-31
  • FCC Certified.
  • Valid from 2018-11-23 until 2049-12-31
  • RoHS Certified.
  • Valid from 2018-11-23 until 2049-12-31
  • Selling Units:Single item
  • Single package size:10X5X5 cm
  • Single gross weight:0.6 kg
  • Package Type:plastic case
  • Lead Time :
  • Quantity(Piece) 1 - 3000 >3000
  • Est. Time(days) 10 To be negotiated
Product Description

 

  • 100% Brand new and high quality!!
  • Rosin flux is used to facilitate soldering.
  • It cleans and prevents metal oxidation which allows solder to create strong, long lasting mechanical and electrical bonds.
  • It also acts as a wetting agent, increasing the flow of solder and the efficiency of the soldering process.
  • Perfect for mobile phones, PC cards and other sophisticated electronic chip-level flux welding.
Specifications
  • Product:BST-706
  • Melting point:138℃
  • Weight:500g
  • Ingredients:Sn99%,Cu0.7%,Ag0.3%















SHENZHEN JINLIYANG TECHNOLOGY CO., LTD.

Tel:+86 158 1877 6906

Wechat:+86 158 1877 6906

Contact Person:kelvin

PDF Show:PDF

Send Inquiry
captcha