New Arrival, Mini heating platform for mobile phone chip glue removing.

Removing glue and tin from mobile phone CPUs can be a challenging task that requires precise temperature control and the right equipment. A mini heating platform designed explicitly for this purpose can greatly aid in the process. Here’s a guide to help you choose and use a mini heating platform for mobile phone CPU glue and tin removal:

Features:

1. Precise Temperature Control: Ability to set and maintain specific temperatures between 160-250°C .
2. Uniform Heating: Even heat distribution to avoid localized overheating.
3. Size and Portability: Compact enough to handle small components but large enough to accommodate the CPU comfortably.
4. Safety Features: Over-temperature protection, heat-resistant surface, and stable design to prevent accidents.

Steps for Using a Mini Heating Platform:

Preparation:

1. Work Area: Set up in a clean, well-ventilated area with good lighting.
2. Tools: Gather necessary tools – tweezers, soldering iron, flux pen, desoldering braid, isopropyl alcohol, brushes, and safety gear (gloves, goggles).

Heating and Removing Glue:

1. Power On and Set Temperature:
   • Plug in the heating platform and power it on.
   • Set the temperature 160°C to soften the glue.
2. Place the CPU:
   • Position the CPU on the heating platform with the glue side facing up.
   • Allow the CPU to heat until the glue softens (this may take a few minutes).
3. Remove Glue:
   • Use plastic or wooden tools to gently scrape off the softened glue.
   • If the glue is stubborn, apply a bit of flux and let it heat further.
   • 

Heating and Removing Tin:

1. Increase Temperature:
   • Increase the platform temperature to around 250-300°C (482-572°F) for tin removal.
2. Place the CPU:
   • Position the CPU on the heating platform with the solder joints exposed.
   • Apply flux to the soldered areas to improve heat transfer and prevent oxidation.
3. Remove Tin:
   • Use a soldering iron and desoldering braid to wick away the molten solder.
   • Carefully remove the CPU once the solder has been removed, ensuring not to overheat.
   • 

Clean Up:

1. Cleaning Residuals:
   • After removing the CPU from the heating platform, allow it to cool down.
   • Clean any remaining flux or residue with isopropyl alcohol and a soft brush.
2. Inspect:
   • Inspect the CPU and the board for any remaining solder or glue.
   • Ensure that the pads and CPU are clean and ready for reattachment.

Safety Precautions:

• Use PPE: Wear gloves and safety glasses to protect against burns and fumes.
• Ventilation: Ensure adequate ventilation to avoid inhaling fumes from heated glue and flux.
• Monitor Temperature: Continuously monitor the temperature to prevent overheating and potential damage to the CPU.
• Handle with Care: Carefully handle the CPU and other components to avoid static discharge or physical damage.

Additional Tips:

• Practice: If you're new to this process, practice on scrap boards to get a feel for the correct temperatures and techniques.
• Quality Flux and Tools: Use high-quality flux and tools to ensure the best results.
• Documentation: Follow the manufacturer's guidelines for your heating platform and any specific instructions for the mobile phone model you are working on.

By following these steps and using a suitable mini heating platform, you can effectively and safely remove both glue and tin from mobile phone CPUs, preparing them for further repair or replacement tasks.