BEST Japanese steel IC Chip BGA Reballing Stencil Solder Template for iPhone X 8 7 6s 6 plus SE 5S 5C 5 Motherboard high quality

• Place of Origin:Guangdong, China (Mainland)
• Brand Name:BESTOOL
• Material:Stainless Steel
• MOQ:20 Pcs
• Weight:7g
• Selling Units:Single item
• Single package size: 10X8X0.01 cm
• Single gross weight:0.07 kg
• Lead Time :Quantity(Piece) 1 - 100 >100
• Est. Time(days) 3 To be negotiated