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BEST Japanese steel IC Chip BGA Reballing Stencil Solder Template for iPhone X 8 7 6s 6 plus SE 5S 5C 5 Motherboard high qualityBEST Japanese steel IC Chip BGA Reballing Stencil Solder Template for iPhone X 8 7 6s 6 plus SE 5S 5C 5 Motherboard high qualityBEST Japanese steel IC Chip BGA Reballing Stencil Solder Template for iPhone X 8 7 6s 6 plus SE 5S 5C 5 Motherboard high qualityBEST Japanese steel IC Chip BGA Reballing Stencil Solder Template for iPhone X 8 7 6s 6 plus SE 5S 5C 5 Motherboard high qualityBEST Japanese steel IC Chip BGA Reballing Stencil Solder Template for iPhone X 8 7 6s 6 plus SE 5S 5C 5 Motherboard high qualityBEST Japanese steel IC Chip BGA Reballing Stencil Solder Template for iPhone X 8 7 6s 6 plus SE 5S 5C 5 Motherboard high quality

BEST Japanese steel IC Chip BGA Reballing Stencil Solder Template for iPhone X 8 7 6s 6 plus SE 5S 5C 5 Motherboard high quality

  • Place of Origin:Guangdong, China (Mainland)
  • Brand Name:BESTOOL
  • Material:Stainless Steel
  • MOQ:20 Pcs
  • Weight:7g
  • Selling Units:Single item
  • Single package size: 10X8X0.01 cm
  • Single gross weight:0.07 kg
  • Lead Time :Quantity(Piece) 1 - 100 >100
  • Est. Time(days) 3 To be negotiated
























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