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BEST Japanese steel IC Chip BGA Reballing Stencil Solder Template for iPhone X 8 7 6s 6 plus SE 5S 5C 5 Motherboard high quality
- Place of Origin:Guangdong, China (Mainland)
- Brand Name:BESTOOL
- Material:Stainless Steel
- MOQ:20 Pcs
- Weight:7g
- Selling Units:Single item
- Single package size: 10X8X0.01 cm
- Single gross weight:0.07 kg
- Lead Time :Quantity(Piece) 1 - 100 >100
- Est. Time(days) 3 To be negotiated
