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BEST-A9-High Quality Universal BGA IC Chip Stencils Heated Template Reballing Stencil for iphone 6 6P
- Place of Origin:Guangdong, China (Mainland)
- Brand Name: BESTOOL
- Material:Stainless Steel
- Application:Chips
- Type:welding model plate
- MOQ: 20pcs
- Weight: 10g
- Certification: CE
- Delivery time: 3-5 Working Days
- Usage: Tin Wire Soldering
- Model: 10-25/35-50/50-70/70-95
- Quality:Excellent
- Selling Units: Single item
- Single package size: 10X8X0.01 cm
- Single gross weight: 0.001 kg
- Package Type: Box
- Lead Time :
- Quantity(Piece) 1 - 100 101 - 1000 1001 - 5000 >5000
- Est. Time(days) 2 8 15 To be negotiated
BEST-A9-High Quality Universal BGA IC Chip Stencils Heated Template Reballing Stencil for iphone 6 6P
1x BGA Reballing Stencils for iPhone 6s Plus
1x BGA Reballing Stencils for iPhone 6s
SHENZHEN JINLIYANG TECHNOLOGY CO., LTD.
Tel:+86 158 1877 6906
Wechat:+86 158 1877 6906
Contact Person:kelvin
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