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BEST-A9-High Quality Universal BGA IC Chip Stencils Heated Template Reballing Stencil for iphone 6 6PBEST-A9-High Quality Universal BGA IC Chip Stencils Heated Template Reballing Stencil for iphone 6 6PBEST-A9-High Quality Universal BGA IC Chip Stencils Heated Template Reballing Stencil for iphone 6 6PBEST-A9-High Quality Universal BGA IC Chip Stencils Heated Template Reballing Stencil for iphone 6 6PBEST-A9-High Quality Universal BGA IC Chip Stencils Heated Template Reballing Stencil for iphone 6 6PBEST-A9-High Quality Universal BGA IC Chip Stencils Heated Template Reballing Stencil for iphone 6 6PBEST-A9-High Quality Universal BGA IC Chip Stencils Heated Template Reballing Stencil for iphone 6 6P

BEST-A9-High Quality Universal BGA IC Chip Stencils Heated Template Reballing Stencil for iphone 6 6P

  • Place of Origin:Guangdong, China (Mainland)
  • Brand Name: BESTOOL
  • Material:Stainless Steel
  • Application:Chips
  • Type:welding model plate
  • MOQ: 20pcs
  • Weight: 10g
  • Certification: CE
  • Delivery time: 3-5 Working Days
  • Usage: Tin Wire Soldering
  • Model: 10-25/35-50/50-70/70-95
  • Quality:Excellent
  • Selling Units: Single item
  • Single package size: 10X8X0.01 cm
  • Single gross weight: 0.001 kg
  • Package Type: Box
  • Lead Time :
  • Quantity(Piece) 1 - 100 101 - 1000 1001 - 5000 >5000
  • Est. Time(days) 2 8 15 To be negotiated

BEST-A9-High Quality Universal BGA IC Chip Stencils Heated Template Reballing Stencil for iphone 6 6P
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SHENZHEN JINLIYANG TECHNOLOGY CO., LTD.

Tel:+86-158 1877 6906

Contact Person:Kelvin

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