Home > Category > Accessories Series > Soldering Paste > BST-507 solder point full containing lead medium temperature tin paste SN63/PB37 aluminum jar BGA tinproan paste mobile phone repair BGA welding tin planting
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BST-507 solder point full containing lead medium temperature tin paste SN63/PB37 aluminum jar BGA tinproan paste mobile phone repair BGA welding tin plantingBST-507 solder point full containing lead medium temperature tin paste SN63/PB37 aluminum jar BGA tinproan paste mobile phone repair BGA welding tin plantingBST-507 solder point full containing lead medium temperature tin paste SN63/PB37 aluminum jar BGA tinproan paste mobile phone repair BGA welding tin plantingBST-507 solder point full containing lead medium temperature tin paste SN63/PB37 aluminum jar BGA tinproan paste mobile phone repair BGA welding tin plantingBST-507 solder point full containing lead medium temperature tin paste SN63/PB37 aluminum jar BGA tinproan paste mobile phone repair BGA welding tin plantingBST-507 solder point full containing lead medium temperature tin paste SN63/PB37 aluminum jar BGA tinproan paste mobile phone repair BGA welding tin plantingBST-507 solder point full containing lead medium temperature tin paste SN63/PB37 aluminum jar BGA tinproan paste mobile phone repair BGA welding tin planting

BST-507 solder point full containing lead medium temperature tin paste SN63/PB37 aluminum jar BGA tinproan paste mobile phone repair BGA welding tin planting

  • Product name: BGA containing lead medium temperature tinnodium paste
  • Product model: BST-507
  • Product category: tin pulp welding oil series
  • Product ingredient: SN63/PB37
  • Melving point temperature: 183 ℃
  • Product hair weight: 200G
  • Product packaging: aluminum box packaging


















 

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