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0.12MM High Precision BGA Reballing Stencil Template for Huawei Logic Board Soldering Repair Tin Net0.12MM High Precision BGA Reballing Stencil Template for Huawei Logic Board Soldering Repair Tin Net0.12MM High Precision BGA Reballing Stencil Template for Huawei Logic Board Soldering Repair Tin Net0.12MM High Precision BGA Reballing Stencil Template for Huawei Logic Board Soldering Repair Tin Net0.12MM High Precision BGA Reballing Stencil Template for Huawei Logic Board Soldering Repair Tin Net0.12MM High Precision BGA Reballing Stencil Template for Huawei Logic Board Soldering Repair Tin Net

0.12MM High Precision BGA Reballing Stencil Template for Huawei Logic Board Soldering Repair Tin Net

  • Brand Name:BESTOOL
  • Material:Stainless Steel
  • MOQ:20 pcs
  • Weight:7g
  • Selling Units:Single item
  • Single package size: 10X8X0.01 cm
  • Single gross weight:0.07 kg
  • Lead Time :Quantity(Piece) 1 - 100 >100
  • Est. Time(days) 3 To be negotiated

















 

 

 

 

 

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