Home > Category > Soldering Station Series > Reballing stencil > 0.12MM High Precision BGA Reballing Stencil Template for Huawei Logic Board Soldering Repair Tin Net
Contact Us
QQ: 2355473736
Skype: Morningkelvin
Article number: + 86-158 1877 6906
Email: kelvin@glf-tool.com Contact Now
0.12MM High Precision BGA Reballing Stencil Template for Huawei Logic Board Soldering Repair Tin Net0.12MM High Precision BGA Reballing Stencil Template for Huawei Logic Board Soldering Repair Tin Net0.12MM High Precision BGA Reballing Stencil Template for Huawei Logic Board Soldering Repair Tin Net0.12MM High Precision BGA Reballing Stencil Template for Huawei Logic Board Soldering Repair Tin Net0.12MM High Precision BGA Reballing Stencil Template for Huawei Logic Board Soldering Repair Tin Net0.12MM High Precision BGA Reballing Stencil Template for Huawei Logic Board Soldering Repair Tin Net

0.12MM High Precision BGA Reballing Stencil Template for Huawei Logic Board Soldering Repair Tin Net

  • Brand Name:BESTOOL
  • Material:Stainless Steel
  • MOQ:20 pcs
  • Weight:7g
  • Selling Units:Single item
  • Single package size: 10X8X0.01 cm
  • Single gross weight:0.07 kg
  • Lead Time :Quantity(Piece) 1 - 100 >100
  • Est. Time(days) 3 To be negotiated



















SHENZHEN JINLIYANG TECHNOLOGY CO., LTD.

Tel:+86-158 1877 6906

Contact Person:Kelvin

PDF Show:PDF

Send Inquiry
captcha