Home > Products > Soldering Station Series > Reballing stencil > 0.12MM High Precision BGA Reba.....
0.12MM High Precision BGA Reballing Stencil Template for Huawei Logic Board Soldering Repair Tin Net0.12MM High Precision BGA Reballing Stencil Template for Huawei Logic Board Soldering Repair Tin Net0.12MM High Precision BGA Reballing Stencil Template for Huawei Logic Board Soldering Repair Tin Net0.12MM High Precision BGA Reballing Stencil Template for Huawei Logic Board Soldering Repair Tin Net0.12MM High Precision BGA Reballing Stencil Template for Huawei Logic Board Soldering Repair Tin Net0.12MM High Precision BGA Reballing Stencil Template for Huawei Logic Board Soldering Repair Tin Net

0.12MM High Precision BGA Reballing Stencil Template for Huawei Logic Board Soldering Repair Tin Net

  • Brand Name:BESTOOL
  • Material:Stainless Steel
  • MOQ:20 pcs
  • Weight:7g
  • Selling Units:Single item
  • Single package size: 10X8X0.01 cm
  • Single gross weight:0.07 kg
  • Lead Time :Quantity(Piece) 1 - 100 >100
  • Est. Time(days) 3 To be negotiated



















SHENZHEN JINLIYANG TECHNOLOGY CO., LTD.

Tel:+86-158 1877 6906

Contact Person:Kelvin

Send your inquiry directly to us
show code on cursor in the input box
( 0 / 3000 )